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Polishing Carriers

PR Hoffman |Polishing Carriers

High quality lapping, grinding, and polishing carriers are a key component to the success of every double-side process.  Our knowledgeable worldwide sales team provides the technical support required to quickly offer customized solutions for all your double-side carrier requirements.  We stock a complete line of carrier raw materials and semi-finished goods to provide consistent delivery of quality carriers that ensure your process stability and part quality.

Please contact PR Hoffman Machine Products to discuss your carrier requirements. We’ll work with you to design the optimum solution for your process, provide additional information, or answer any questions you may have.

Insert Carriers

  • Custom designs we create, or we can put your own design ideas to work for you
  • Custom materials featuring our own licensed and patented designs
  • Carriers molded from proprietary grades and blends of long-lasting polymer
  • A wide selection of high-quality spring and stainless steels
  • Wafer sizes ranging from 100 mm to 450 mm in diameter
  • Used for silicon, sapphire lapping and compound substrate wafers
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Lapping, Polishing, and Grinding Carriers

  • The wafers are afforded greater freedom of rotation with reduced edge damage which helps improve TTV
  • 100mm – 450mm Wafer size
  • Reduce Cost of Ownership
  • Customer Design for your specific application
  • ISO 9001:2015 Certified
  • Recognized as Worldwide Supplier
  • Precision Thickness Control
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