Semiconductor wafer polishing templates made to PR Hoffman's exacting standards for material selections and manufacturing methods have earned us choice status as a preferred vendor to the semiconductor industry. We manufacture waxless mount assemblies for single-side polishing of silicon wafers of all diameters.
Polishing templates are made from a buffed porous mounting material that, when wet, produces the necessary adhesion to hold the wafer in place. To ensure that the wafer stays in place, we add a fibreglass epoxy laminate template. The buffed mounting material allows the wafer to rotate in the pocket. We also supply a non-porus mounting material for use in applications which
PR Hoffman's semiconductor wafer polishing templates are made flat to stay flat. The buffed poromeric material is backed by a non-absorbent, non-compressible fabric. The pad stays resilient evenly across the full width of the recess, producing measurably flatter wafers.
Each template is backed with a pressure-sensitive adhesive, specifically suited to withstand the effects of the polishing process. Our templates are assembled in a clean, climate-controlled environment to limit particle contamination. All template edges are milled smooth to prevent shredding during the polishing process. The final product is sealed in one-load packages to keep templates clean and uncontaminated until use.
- Technical Data Sheet - Template Material and application information.
Literature:
Templates.pdf (~175kb) Template Brochure
