Carriers... for lapping and polishing. |
PR Hoffman's versatile manufacturing capabilities enable us to manufacture double-side lapping and DSP polishing carriers to fit any customer specifications. Stock materials include spring steel (strongest, most durable, for closest tolerances of thickness and flatness), stainless steel, spring steel with molded plastic inserts (for use in manufacturing large diameter semiconductor wafers), LamitexTM (FR-4/G-10 fiberglass reinforced, non-corroding and non-water absorbing, ideal for thicker parts), PVC (for lapping and polishing relatively thick parts), Polycarbonate (Lexan®) - (for scratch-free polishing applications), and vinyl (most economical for short runs of thin parts), phenolic (low-cost, resin-laminated cloth/paper, absorbs water, better for use with oil-based slurries). |
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MATERIALS
- Spring Steel (0.004" -to- 0.125") - Spring steel is the strongest, most durable carrier material. Closer tolerances of thickness and flatness are obtainable with spring steel material making it ideal for thin work. PR Hoffman uses special proprietary grade of spring steel for all of its carriers. We also supply carriers in stainless, hard-rolled (HR) and cold-rolled (CRS) steel in thicknesses up to 1/8" - click for list of Spring, Stainless, and CRS Steel normally stocked by PR Hoffman - contact us for current availability.
- LamitexTM (0.010" -to- 1.00") - LamitexTM, also known as G-10 and FR-4, is an epoxy-based material reinforced with fiberglass. LamitexTM is an excellent alternative to steel offering excellent machining capabilities, high mechanical strength, noncorrosive, and low water absorbing properties. Lamitex is also an excellent choice for large thick parts - click for list of LamitexTM normally stocked by PR Hoffman - contact us for current availability.
- PVC (0.060" -to- 1.00") - PVC is a thermoplastic vinyl. Combining chemical inertness, high strength-to-weight ratio and economical cost, PVC is an excellent choice for corrosion resistant applications. PVC can be sanded to achieve tight thickness tolerances and is commonly used for lapping thick parts.
- Phenolic (0.015" -to- 0.750") - Phenolic is a resin binder reinforced with cotton fabric. Phenolic is very wear resistant and stronger than most plastics. It is typically used with oil-based slurries due to its water absorbing qualities. Phenolic is an excellent choice when steel or fiberglass are not permitted in a process.
- Lexan (0.020" -to- 0.500") - A plastic without fiber reinforcement, this material gives up some of the strength of LamitexTM but does not cause scratches in polishing applications.
- Vinyl (0.010" -to- 0.080") - Softer and less expensive than lexan, vinyl is an economical choice for short runs on smaller lapping machines.
INSERT CARRIERS FOR SEMICONDUCTOR WAFER PROCESSING
The insert carrier features our exclusive design and special formulated materials that work in unison to protect the edge profile of a wafer while providing the strength and durability of a traditional steel carrier. PR Hoffman uses high quality steel that has been uniquely prepared to create a lasting bond with the plastic that is molded into each work hole. This type of carrier is commonly used for processing 100 mm, 125 mm, 150 mm, 200 mm, 300 mm, and 450 mm silicon & semiconductor wafers.
PTC® INSERT CARRIERS FOR PRECISION DSP WAFER POLISHING
PR Hoffman can also manufacture PTC® Insert Carriers to high-precision (+/- 2.5um) thickness. Click link above for our PTC® brochure.
CUSTOM LASER-CUT PARTS (contract parts other than carriers)
In addition to double-side lapping and polishing carriers, PR Hoffman Machine Products also supplies custom laser cut components in thin stainless & spring steel to aerospace, industrial, and decorative arts industries. A short video showing our laser cutting small parts is on the page linked above.
Fax: 717-243-4542